The 62nd JSAP Spring Meeting, 2015

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

[14a-A29-1~11] 13.4 Si wafer processing /MEMS/Integration technology

Sat. Mar 14, 2015 9:00 AM - 12:00 PM A29 (6A-204)

11:45 AM - 12:00 PM

[14a-A29-11] MOSFET fabrication on wafers that is refurbished by minimal grinding and polishing machines

〇Norio Umeyama1, Takashi Yajima1, Hitoshi Asano1, Fumito Imura1, Katsuhiko Nakato1, Sommawan Khumpuang1, 2, Shiro Hara1, 2 (1.MINIMAL, 2.AIST)

Keywords:Minimal Fab,Grinding and Polishing,CMP