The 77th JSAP Autumn Meeting, 2016

Presentation information

Oral presentation

13 Semiconductors » 13.9 Optical properties and light-emitting devices

[13p-A35-1~15] 13.9 Optical properties and light-emitting devices

Tue. Sep 13, 2016 1:15 PM - 5:15 PM A35 (303-304)

Hiroko Kominami(Shizuoka Univ.), Yasushi Nanai(Nihon Univ.)

5:00 PM - 5:15 PM

[13p-A35-15] A Study on the Robustness and the Decomposition Mechanism of Encapsulation Resins Applying to Deep Ultra Violet LEDs

Yosuke Nagasawa1, Akira Hirano1, Ko Aosaki2, Masamichi Ipponmatsu1, Hiroshi Amano3, Isamu Akasaki4 (1.UV Craftory CO., Ltd., 2.Asahi Glass CO., Ltd., 3.Nogoya University, 4.Meijo University)

Keywords:Deep ultra violet light emitting diodes, Encapsulation resins

Encapsulation is one of key technologies for light emitting diodes (LEDs), which goes with deep ultra violet (DUV) LEDs. Comparing a silicone polymer and a series of carbon fluoric polymers known as DUV transparent substances, we explored long term stability of those materials when applying to DUV LEDs. The report shows that the necessary characteristics and polymer structures, including their terminal groups, of the over-coaitng resins, as well as their decomposition mechanism.