[14a-B11-1~7] 12.4 Organic light-emitting devices and organic transistors

[14a-B11-6] Fabrication of OFET array on Curved Surface by Thermal Molding

〇Kento Watanabe¹, Yushi Sasaki¹, Junro Hayashi¹, Masatoshi Sakai¹, Yugo Okada^1,2, Hiroshi Yamauchi¹, Yuichi Sadamitsu³, Shoji Shinamura³, Kazuhiro Kudo¹ (1.Chiba Univ., 2.Center for Frontier Sceience, Chiba Univ., 3.Nippon Kayaku Co., Ltd.)

Keywords:organic semiconductor, plastic electronics, Curved surface

There are many plastic products of various shapes fabricated by excellent molding techniques in our modern life. We conceive the novel electronics using the freely curved surface and propose thermal molding as implementation of the novel electronics. Thermal molding is a fabrication method of organic semiconductor layer and curved surface simultaneously using a pair of metal molds and thermoplastic substrate. In this talk, we have fabricated real-human-finger shape OFET array and have realized the operation of the transistors in the curved surface.