The 77th JSAP Autumn Meeting, 2016

Presentation information

Print

Oral presentation

11 Superconductivity » 11.4 Analog applications and their related technologies

[14p-D61-1~20] 11.4 Analog applications and their related technologies

Wed. Sep 14, 2016 1:15 PM - 7:00 PM D61 (Bandaijima Bldg.)

Toshihiko Kiwa(Okayama Univ.), Shigehito Miki(NICT), Tohru Taino(Saitama Univ.)

6:30 PM - 6:45 PM

[14p-D61-19] Fabrication method of superconducting TSV for STJ detector using 3D integration technique

〇Kohei Morita1, Soki Hatakeyama1, Masato Naruse1, Hiroaki Myoren1, Masahiro Aoyagi2, Tohru Taino1 (1.Saitama Univ., 2.AIST)

Keywords:Superconducting Tunnel Junction, Through Si Via, Three-Dimensional structure