The 63rd JSAP Spring Meeting, 2016

Presentation information

Oral presentation

15 Crystal Engineering » 15.6 Group IV Compound Semiconductors (SiC)

[20p-H101-1~21] 15.6 Group IV Compound Semiconductors (SiC)

Sun. Mar 20, 2016 1:15 PM - 7:00 PM H101 (H)

Masashi Kato(NITech), Mitsuo Okamoto(AIST), Mitsuru Sometani(Fuji Electric)

2:45 PM - 3:00 PM

[20p-H101-7] Consideration of oxide removal process in electrochemical etching of p-SiC

Taro Enokizono1, Tsunenobu Kimoto1, Jun Suda1 (1.Kyoto Univ.)

Keywords:electrochemical etching,SiC,MEMS

Electrochemical etching (EC etching), which removes p-SiC selectivity, is one of essential process for SiC MEMS devices. In EC etching, uniform etching and anisotropy control of the etching are requested. For the purpose, it is important to understand the reaction mechanisms. We performed EC etching under constant current flow. We discuss oxide removal process during EC etching based on analysis of time change of applied voltage during etching.