The 63rd JSAP Spring Meeting, 2016

Presentation information

Poster presentation

3 Optics and Photonics » 3.13 Semiconductor optical devices

[21p-P2-1~7] 3.13 Semiconductor optical devices

Mon. Mar 21, 2016 1:30 PM - 3:30 PM P2 (Gymnasium)

1:30 PM - 3:30 PM

[21p-P2-7] The Evaluation of QDIP Array Sensor by Infrared Imaging

Chenhui Huang1, Tomo Tanaka1, Sota Kagami1,3, Masahiro Kakuda3, Katsuyuki Watanabe4, Sei Inoue2, Kenji Nanba2, Yuichi Igarashi1,3, Masahiro Tanomura1, Yoshihiro Nambu1,3, Tsuyoshi Yamamoto1,3, Shinichi Yorozu1,3, Yasuhiko Arakawa3,4 (1.NEC SE Labs., 2.NEC MI Division, 3.NanoQuine, 4.IIS the Univ. of Tokyo)

Keywords:QDIP sensor,FPA,Infrared imaging

Thermal infrared imaging technology is applied to the field of the industry, the medical treatment and the search of resources. In these researches, the further high sensitivity is requested. A quantum dot infrared detector was studied as the infrared detector which is sensitive and is low dark current in recent years, and our group confirmed the improvement of ratio detection D* of single device QDIP with approach barrier layer structure. Wavelength 5.5 um as which its structure was adopted by this research. An array sensor was manufactured by QDIP with a sensitivity peak to infrared light of 5.5 um and the performance was evaluated for imaging process and the acquired infrared image were performed.