[7a-C18-1~9] 10.2 スピン基盤技術・萌芽的デバイス技術

▲ [7a-C18-7] Bending dependence of flexible heat-flux sensors based on the spin Seebeck effect

〇Akihiro Kirihara¹、Masahiko Ishida¹、Koichi Kondo²、Yuma Iwasaki¹、Hiroko Someya¹、Ken-ichi Uchida^3,4、Eiji Saitoh^3,5,6、Naoharu Yamamoto²、Shinichi Yorozu¹ (1.NEC、2.TOKIN、3.IMR, Tohoku Univ.、4.NIMS、5.AIMR, Tohoku Univ.、6.JAEA)

キーワード：spin Seebeck effect, heat-flux sensor, ferrite plating

Thermoelectric (TE) devices using the spin Seebeck effect (SSE) are expected to enable us to implement TE function in various places. Here we demonstrate flexible heat-flux sensors based on the SSE, and investigated their bending dependence. [1] A. Kirihara, et al., Sci. Rep. 6, 23114 (2016).