The 78th JSAP Autumn Meeting, 2017

Presentation information

Oral presentation

3 Optics and Photonics » 3.7 Laser processing

[7a-S45-1~8] 3.7 Laser processing

Thu. Sep 7, 2017 9:00 AM - 11:15 AM S45 (Conf. Room 6)

Tadatake Sato(AIST), Hiroyuki Wada(Titech)

9:30 AM - 9:45 AM

[7a-S45-3] Residual stress field by a high power laser

Yoichiro Hironaka1, Eisuke Miura3, Ryunosuke Kuroda3, Kohei Miyanishi1, Keisuke shigemori1, Takeshi Matsuoka2, Norimasa Ozaki2, Ryosuke Kodama1, Takashi Kurita4, Norio Kurita4, Takeshi Watari4, Yoshio Mizuta4, Yuki Kabeya4 (1.ILE, 2.Osaka Univ., 3.AIST, 4.HPK)

Keywords:Pulsed Laser, peening

Various reforming processing is studied by corrosion-resistant improvement by surface modification, stress-corrosion cracking prevention by residual stress field and improvement of the fatigue strength aiming at high quality-ization of the structure material of the metal. Using the super-high pressure a laser peening technique generates by a laser ablation which make a shock wave transmitted inside the material and restrain development of a crack and destruction by generation of the residual stress field. A laser peening technique, local processing and, non-contact process, remains compressive stress layer formation to the material depth is possible than a conventional shot peening with the feature. We investigated at the large area irradiation and the long pulse laser irradiation which become possible to use a high pulse energy laser (>100 J) by this research and an advancing new search of a laser machining method and explication of processing to compressive stress layer formation to the material depth from a method in the past.