[7p-C19-1~10] Challenges for 'multi-scale' processing - dry, wet, or else?...

[7p-C19-7] Electro-and electroless plating for nano to micro processes

〇Shoso Shingubara¹ (1.Kansai Univ.)

Keywords:plating, LSI, TSV

Electro and electroless plating are widely used from Jisso boards to LSI multilevel interconnections. I would like to discuss difference of additive effect on Cu bottom-up fill between the electro-plating and the electroless plating technologies. Furthermore, all-wet TSV filling process as well as metal assisted Si etching for TSV formation will be discussed.