The 78th JSAP Autumn Meeting, 2017

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Poster presentation

4 JSAP-OSA Joint Symposia 2017 » 4 JSAP-OSA Joint Symposia 2017 (poster)

[8a-PB2-1~11] 4 JSAP-OSA Joint Symposia 2017 (poster)

Fri. Sep 8, 2017 9:30 AM - 11:30 AM PB2 (P)

9:30 AM - 11:30 AM

[8a-PB2-1] 3D digital holographic semiconductor metrology using Fourier Modal Method

SHIN-WOONG PARK1, JONG HYUN LEE1, HWI KIM1 (1.Korea Univ.)

Keywords:metrology, TSOM, Fourier modal method

Through-focus Scanning Optical Microscope (TSOM) technology, which has been attracting much attention in the field of semiconductor measurement recently, using a conventional optical microscope, collects 2D images at multiple focal positions for creating 3D data space and extracts intensity profile from them. It is a breakthrough technology for the inspection and measurement of a recent complicated 3D structure semiconductor.
However, since this TSOM technology uses physical z-axis movement, jittering necessarily occurs, which seriously affects image reliability. Therefore, in this paper, we propose a 3D digital holography technique, which can calculate the diffractive light wave information of the semiconductor sample in the stationary state without such physical movement.