2017年第78回応用物理学会秋季学術講演会

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4 JSAP-OSA Joint Symposia 2017 » 4 JSAP-OSA Joint Symposia 2017 (poster)

[8a-PB2-1~11] 4 JSAP-OSA Joint Symposia 2017 (poster)

2017年9月8日(金) 09:30 〜 11:30 PB2 (国際センター2F)

09:30 〜 11:30

[8a-PB2-1] 3D digital holographic semiconductor metrology using Fourier Modal Method

SHIN-WOONG PARK1、JONG HYUN LEE1、HWI KIM1 (1.Korea Univ.)

キーワード:metrology, TSOM, Fourier modal method

Through-focus Scanning Optical Microscope (TSOM) technology, which has been attracting much attention in the field of semiconductor measurement recently, using a conventional optical microscope, collects 2D images at multiple focal positions for creating 3D data space and extracts intensity profile from them. It is a breakthrough technology for the inspection and measurement of a recent complicated 3D structure semiconductor.
However, since this TSOM technology uses physical z-axis movement, jittering necessarily occurs, which seriously affects image reliability. Therefore, in this paper, we propose a 3D digital holography technique, which can calculate the diffractive light wave information of the semiconductor sample in the stationary state without such physical movement.