[8p-PA2-1~19] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[8p-PA2-9] Fabrication of SOD substrate with SiO₂ bonding layer thinned by sputter etching

〇Masahiro Nagata¹, Ryouya Shirahama¹, Sethavut Duangchan¹, Akiyoshi Baba¹ (1.Kyushu Inst.)

Keywords:sputter etching, surface-activated bonding