[14a-512-1~11] 3.7 Laser processing

[14a-512-2] Formation of metal interconnection by combination of laser direct writing and plating process

〇Akira Watanabe¹, Jinguang Cai^1,2 (1.IMRAM, Tohoku Univ., 2.China Acad. Eng. Phys.)

Keywords:laser direct writing, Cu interconnection, plating process

Metal interconnection and passive device such as an antenna were fabricated by combination of the on-demand process based on laser direct writing using metal nanoparticle ink and plating process. The combination of laser direct writing of a Cu seed layer using Cu nanoarticle ink and Cu electroplating gave a Cu interconnection with the thickness thicker than 2 micrometer.