[15a-315-1~10] 13.8 Compound and power electron devices and process technology

[15a-315-10] Evaluation of Al foil/n⁺-Si/n-GaN contacts by surface activated bonding

〇Sho Morita¹, Takuya Nishimura¹, Jianbo Liang¹, Moeko Matsubara², Marwan Dhamrin², Yoshitaka Nishio², Naoteru Shigekawa¹ (1.Osaka City Univ., 2.Toyo Aluminium K.K.)

Keywords:surface activated bonding