The 64th JSAP Spring Meeting, 2017

Presentation information

Oral presentation

CS Code-sharing session » CS.4 7. Code-sharing Session: Beam Technology and Nanofabrication

[15a-423-1~9] CS.4 7. Code-sharing Session: Beam Technology and Nanofabrication

Wed. Mar 15, 2017 9:00 AM - 11:30 AM 423 (423)

Atsushi Yokoo(NTT), Masaru Nakagawa(Tohoku University)

10:15 AM - 10:30 AM

[15a-423-5] UV nanoimprint process for opaque materials by use of delayed UV cure resin

Hiroaki Kawata1, Jiei Tutui1, Masaaki Yasuda1, Yoshihiko Hirai1 (1.Osaka Pref. Univ.)

Keywords:UV nanoimprint, delayed UV cure

It is impossible to carry out the conventional UV-NIL when both the substrate and the mold are opaque. In this report, a novel UV-NIL process is developed by use of delayed UV cure resin, whose hardening starts after a few minutes passage from UV exposure. The Si substrate and the Si mold, which are opaque for the UV light, are used in order to carry out the new UV-NIL process. The used mold has the 2 μm half-pitch line-and-space pattern. The fabricated pattern on the delayed UV cure resin is almost same as the PMMA pattern fabricated by the conventional T-NIL. It is demonstrated that the new UV-NIL is successfully done for the opaque mold and substrate.