[15p-211-1~18] 16.3 Bulk, thin-film and other silicon-based solar cells

[15p-211-9] The Impact of Diamond Wire Quality on Thin Wafer Slicing for PV Cells

〇TETSUO FUKUDA¹, NOBUTAKA SUZUKI¹, HIROMICHI ONO², YOSHIYUKI SANPEI², KATSUTO TANAHASHI¹, KATSUHIKO SHIRASAWA¹, HIDETAKA TAKATO¹ (1.AIST, 2.FUKUSHIMA TECH CNTRE)

Keywords:silicon, diamond wire, surface roughness

We cut CZ silicon single crystals into 120um thick wafers using conventional and improved diamond wires. The surface roughness of wafers cut by improved wires ia smaller than that of wafers cut by conventinal wires. This suggests that the wafers cut by improved wires is mechanically stronger than wafers cut by conventional wires.