[17a-P5-1~23] 12.4 Organic light-emitting devices and organic transistors

[17a-P5-19] Patterning of Semiconductor and Insulators by Electrophotographic Technology and Formation of Thin Film by Ultrasonic Welding

〇(B)Yuki Horiuchi¹, Toyoshima Kenji², Koh Tokuyuki², Sakai Masatoshi², Okada Yugo^2,3, Sadamitsu Yuichi⁴, Hashimoto Yuta⁴, Kudo Kazuhiro² (1.Chiba Univ., 2.Chiba Univ, 3.Center for Frontier Science, 4.Nippon Kayaku Co. Ltd.)

Keywords:organic semiconductor, Printed Electronics, Flexible Electronics

Various printing processes have been studied as a technique for printed electronics with high throughput. We have developed thermal press method,tharmal lamination and ultrasonic melting method for thin film formation of organic semiconductor . Solvent-free patterning of organic semiconductor materials using electrophotographic technology has also been conducted. In this presentation, insulator material patterning by the same technology and formation of an insulating film by ultrasonic melting are reported.