2:15 PM - 2:30 PM
△ [18p-212A-5] Investigation of weighting dependency for InP/Si chip-on-wafer plasma activated bonding
〇(M2)Liu Bai1, Takehiko Kikuchi1,3, Nobuhiko Nishiyama1,2, Hideki Yagi3, Tomohiro Amemiya1,2, Shigehisa Arai1,2 (1.Tokyo Tech, 2.FIRST, 3.SEI)