[18p-212A-1~14] 3.15 Silicon photonics

△ [18p-212A-5] Investigation of weighting dependency for InP/Si chip-on-wafer plasma activated bonding

〇(M2)Liu Bai¹, Takehiko Kikuchi^1,3, Nobuhiko Nishiyama^1,2, Hideki Yagi³, Tomohiro Amemiya^1,2, Shigehisa Arai^1,2 (1.Tokyo Tech, 2.FIRST, 3.SEI)

Keywords:III-V/Si hybrid, partial bonding, weighting dependency