The 79th JSAP Autumn Meeting, 2018

Presentation information

Symposium (Oral)

Symposium » Ubiquitous Power Lasers

[18p-233-1~13] Ubiquitous Power Lasers

Tue. Sep 18, 2018 1:30 PM - 6:30 PM 233 (233)

Fumihiko Kannari(Keio Univ.), Ryo Yasuhara(NIFS), Toshiyuki Kumagai(JST MIRAI)

6:00 PM - 6:10 PM

[18p-233-12] Surface Activated Bond properties of Distributed Face Cooling structure for high average power applications

〇(D)Arvydas Kausas1, Lihe Zheng1, Takunori Taira1 (1.Inst. Molecular Sc)

Keywords:Distributed face cooling, Surface activated bonding, thermal lensing

In this work we present multi-crystal Distributed Face Cooling chip done by Surface Activated Bonding technology. This chip is made of a consecutive pairs of Sapphire and Nd:YAG crystals and can produce twice as much output as compared to the single Nd:YAG laser. Also various mechanical and optical tests were done in order to evaluate various parameters for high average power operation.