The 79th JSAP Autumn Meeting, 2018

Presentation information

Poster presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[18p-PB2-1~7] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Tue. Sep 18, 2018 1:30 PM - 3:30 PM PB (Shirotori Hall)

1:30 PM - 3:30 PM

[18p-PB2-7] Development of Nickel Silicide formation mothod for Si-ULSI by using hydrogen radical heating

〇(DC)Hiroki Nakaie1, Tetsuji Arai1, Kazuki Kamimura1, Kesuke Arimoto1, Kosuke Hara1, Mai Shirakura1, Chiaya Yamamoto1, Junji Yamanaka1, Kiyokazu Nakagawa1, Toshiyuki Takamatsu2 (1.Univ. of Yamanashi, 2.SST Inc.)

Keywords:Electrode formation, Nickel Silicide