The 79th JSAP Autumn Meeting, 2018

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[19a-233-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Wed. Sep 19, 2018 9:00 AM - 12:00 PM 233 (233)

Reo Kometani(Univ. of Tokyo)

9:00 AM - 9:30 AM

[19a-233-1] [JSAP Paper Award Speech] Reexamination of Fermi level pinning for controlling Schottky barrier height at metal/Ge interface

Tomonori Nishimura1, Takeaki Yajima1, Akira Toriumi1 (1.The Univ. of Tokyo)

Keywords:JSAP Paper Award