The 79th JSAP Autumn Meeting, 2018

Presentation information

Print

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[19a-233-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Wed. Sep 19, 2018 9:00 AM - 12:00 PM 233 (233)

Reo Kometani(Univ. of Tokyo)

9:30 AM - 9:45 AM

▲ [19a-233-2] [Young Scientist Presentation Award Speech] Evaluation of Contact Resistivity of Ni(Ge1-ySny)/Heavily Sb-doped n-Ge1-xSnx Contact

〇Jihee Jeon1, Akihiro Suzuki1,2, Kouta Takahashi1,2, Osamu Nakatsuka1,3, Shigeaki Zaima4 (1.Grad. Sc. of Eng., Nagoya Univ., 2.Research Fellow of JSPS, 3.IMASS, Nagoya Univ., 4.IIFS, Nagoya Univ.)

Keywords:Contact Resistivity, GeSn, n-type doping