The 79th JSAP Autumn Meeting, 2018

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[19a-233-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Wed. Sep 19, 2018 9:00 AM - 12:00 PM 233 (233)

Reo Kometani(Univ. of Tokyo)

10:15 AM - 10:30 AM

[19a-233-5] SiC Nanodots Formation in Poly-Si and Amorphous-Si Substrate using Hot C+ Ion Implantation

Rikito Kanazawa1, Takashi Aoki1, Toshiyuki Sameshima2, Tomohisa Mizuno1 (1.Kanagawa Univ., 2.Tokyo Univ Agri. Tech.)

Keywords:semiconductor, SiC, quantum dot