The 79th JSAP Autumn Meeting, 2018

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13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[19a-233-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Wed. Sep 19, 2018 9:00 AM - 12:00 PM 233 (233)

Reo Kometani(Univ. of Tokyo)

10:30 AM - 10:45 AM

[19a-233-6] Process Dependence of SiC Nano-Dots Size in Bulk-Si Substrate

〇Masaki Yamamoto1, Takashi Aoki1, Sameshima Toshiyuki2, Tomohisa Mizuno1 (1.Kanagawa Univ., 2.Tokyo Univ Agri. Tech.)

Keywords:semiconductor, SiC, quantum dot