The 79th JSAP Autumn Meeting, 2018

Presentation information

Oral presentation

7 Beam Technology and Nanofabrication » 7.3 Micro/Nano patterning and fabrication

[19p-234A-1~10] 7.3 Micro/Nano patterning and fabrication

Wed. Sep 19, 2018 1:30 PM - 4:15 PM 234A (234-1)

Jiro Yamamoto(HITACHI), Jun Taniguchi(Tokyo Univ. of Sci.), Hiroaki Kawata(Osaka Pref. Univ.)

3:00 PM - 3:15 PM

[19p-234A-6] Fabrication of through hole electrodes for flexible devices

〇(M1)Kazuki Honjo1, Taniguchi Jun1 (1.TUS)

Keywords:through hole electrode

In recent years, There is a growing demand for flexible devices, but there is no established method for manufacturing devices that interconnect with both sides of flexible substrate and perform two operations. For this reason, we devised to create a through hole electrodes by forming a through hole by ultraviolet nanoimprint lithography and filling with silver ink as a new method of integrating a flexible devices.