5:00 PM - 5:30 PM
[19p-432-8] Wafer Bonding Technologies for 3D Integration
Keywords:3D integration
Presentation information
Symposium (Oral)
Symposium » Recent Progresses and Developments of Si Integrated Circuit Technologies with 3D Integrations
[19p-432-1~8] Recent Progresses and Developments of Si Integrated Circuit Technologies with 3D Integrations
Wed. Sep 19, 2018 1:45 PM - 5:30 PM 432 (432)
Shin-Ichiro Kuroki(Hiroshima Univ.), Makoto Nakamura(Fujitsu Labs)