Numerical Analysis for Reactions of TEOS and SiO<sub>2</sub> in Plasma Enhanced CVD

Presentation information

Oral presentation

8 Plasma Electronics » 8.2 Plasma deposition of thin film, plasma etching and surface treatment

Thu. Sep 20, 2018 9:00 AM - 12:15 PM 438 (3F_Lounge)

12:00 PM - 12:15 PM

〇HU LI¹, Satoru Kawaguchi^2,3, Hisashi Higuchi¹, Kazuki Denpoh¹, Kohki Satoh² (1.TTS, 2.Muroran Inst. Tech., 3.JSPS Research Fellow)

Keywords:PECVD, Simulation, Modeling