The 79th JSAP Autumn Meeting, 2018

Presentation information

Print

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[21a-233-1~12] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Fri. Sep 21, 2018 9:00 AM - 12:00 PM 233 (233)

Takashi Noguchi(Univ. of the Ryukyus), Taizoh Sadoh(Kyushu Univ.)

10:00 AM - 10:15 AM

△ [21a-233-5] Improving hole mobility of solid-phase crystallized Ge thin film by using GeO2 underlayer and its development onto plastic substrate

〇Toshifumi Imajo1, Kenta Moto1, Ryota Yoshimine1, Takashi Suemasu1, Kaoru Toko1 (1.Univ. of Tsukuba)

Keywords:Ge, thin film, SPC