The 79th JSAP Autumn Meeting, 2018

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power electron devices and process technology

[21a-331-1~12] 13.7 Compound and power electron devices and process technology

Fri. Sep 21, 2018 9:00 AM - 12:15 PM 331 (International Conference Room)

Tetsuo Narita(Toyota Central R&D Labs., Inc.)

11:15 AM - 11:30 AM

[21a-331-9] AlGaN/GaN HEMTs fabricated using AlGaN regrowth on RIE-GaN surfaces

Akio Yamamoto1, Keito Kanatani1, Masaaki Kuzuhara1 (1.Univ. of Fukui)

Keywords:GaN, RIE, HEMT

As a part of the evaluation of 2DEG properties in AlGaN/GaN structures prepared by the AlGaN regrowth on RIE-GaN surfaces, the fabrication and DC characteristics of HEMTs employing such AlGaN/GaN structures were investigated. It was confirmed that the HEMTs fabricated had excellent DC properties such as a drain current of ≥ 0.5 A/mm, good pinch-off properties and very small hysteresis (ΔV ≤ 30 mV). Based on these achievements, a trenched vertical AlGaN/GaN HEMT was realized.