[21a-PA2-1~28] 12.1 Fabrications and Structure Controls

[21a-PA2-20] Evaluation of Stress buffer layer for highly integrated flexible device systems

〇Yuki Susumago¹, Achille Jacquemond^1,2, Noriyuki Takahashi³, Hisashi Kino⁴, Tetsu Tanaka^1,5, Takafumi Fukushima¹ (1.Grad.Sch.of Eng, 2.INSA Lyon, 3.Sch.of Eng, 4.FRIS, Tohoku Univ., 5.Grad.Sch. of Biomed.Eng,Tohoku Univ.)

Keywords:flexible hybrid electronics