2018年第65回応用物理学会春季学術講演会

講演情報

一般セッション(口頭講演)

13 半導体 » 13.3 絶縁膜技術

[17a-F206-1~13] 13.3 絶縁膜技術

2018年3月17日(土) 09:00 〜 12:30 F206 (61-206)

井上 真雄(ルネサス)、渡邉 孝信(早大)

11:30 〜 11:45

[17a-F206-10] Valency of cation rather than Oxygen Density may govern the Dipole Moment at high-k/SiO2 interfaces

〇(M1)Marc Perea1、Okuto Takahashi1、Koki Nakane1、Nobuhiro Nagasawa1、Takanobu Watanabe1 (1.Waseda University)

キーワード:high-k dielectric, dipole formation, oxide

We show that the electric dipole formed at the high-k/SiO2 interface is highly correlated to the mean valence number of the high-k cations. Molecular Dynamics (MD) simulations were performed, building high-k/SiO2 interfaces for around 1300 Al, Mg, Sr and Ti based multi-component oxides, including Al2O3, MgO, SrO and TiO2, which serve as easily identifiable references. The dipole moment of each oxide is plotted against both the normalized oxygen density (NOD, normalized around that of SiO2) and the mean valence number of the oxide’s cations. Out of the two, the mean valence number of cations shows the higher correlation coefficient by a significant margin. At the same time, the normalized oxygen density plot shows unexpected results, according to the oxygen density difference accommodation model. These results suggest that, instead of the migration of oxygen ions, the migration of metal cations plays a huge factor in the formation of the dipole layer in high-k/SiO2 interfaces.