Optimization of Distributed Face Cooling structure for high average power applications

Arvydas Kausas; Lihe Zheng; Takunori Taira

Presentation information

Oral presentation

3 Optics and Photonics » 3.5 Laser system and materials

[17p-B403-1~17] 3.5 Laser system and materials

Sat. Mar 17, 2018 1:15 PM - 6:00 PM B403 (53-403)

Masayuki Suzuki(Aichi Medical Univ.), Yoichi Sato(IMS), Kazuyuki Uno(Univ. of Yamanashi)

5:00 PM - 5:15 PM

▲ [17p-B403-14] Optimization of Distributed Face Cooling structure for high average power applications

〇(D)Arvydas Kausas¹, Lihe Zheng¹, Takunori Taira¹ (1.Inst. for Molecular Science)

Keywords:distributed face cooling, thermal lensing, Surface activated bonding

By using Surface Activated Bonding technology, we produced 9-chip crystal consisting of five Sapphire crystals and four Nd³⁺:YAG crystals. Fiber coupled CW diode laser with maximum incident pump power 86 W was used and the output power reached 46 W. The slope efficiency under continuous wave (CW) pump power was 64.6%.