[18p-B201-1~14] 3.15 Silicon photonics

[18p-B201-7] III-V on SiC platform for photonics application

〇Takaaki Sanjoh¹, Naoki Sekine², Shinichi Takagi^1,2, Mitsuru Takenaka^1,2 (1.The Univ. of Tokyo, Faculty of Engineering, 2.The Univ. of Tokyo, School of Engineering)

Keywords:SiC, Wafer bonding, Heat dissipation

A III - V on SiC structure for photonics was proposed by Takenaka (2017). This structure is superior to a III-V-on-insulator structure in heat dissipation and thermal stress. Numerical analysis and experiments were performed on the heat dissipation characteristics of this III-V on SiC structure and a conventional III-V-on-insulator structure.