[18p-B203-1~17] 3.13 Semiconductor optical devices

[18p-B203-7] Structure Evaluation of Taper-type Optical Mode Converter between III-V/SOI Hybrid Device and Si Waveguide

〇Junichi Suzuki¹, Fumihito Tachibana¹, Kumi Nagasaka¹, Moataz Eissa¹, Liu Bai¹, Takuya Mitarai¹, Tomohiro Amemiya^1,2, Nobuhiko Nishiyama^1,2, Shigehisa Arai^1,2 (1.Tokyo Tech, 2.FIRST)

Keywords:Direct wafer bonding technology, III-V/Si hybrid integration, Taper-type optical mode converter

A taper-type optical mode converter is generally used for coupling between the III-V/SOI hybrid part and the Si waveguide in the hybrid PICs fabricated by the direct wafer bonding technology, but the fluctuation of the taper structure causes a degradation of the coupling efficiency. This time, we estimated the coupling efficiency by using the measurement characteristices of the fabricated hybrid device and investigated the method for the improvement.