[19p-C304-1~9] Challenge to heat dissipation problems by organic-inorganic materials -Forefront of physics and application-

[19p-C304-3] Enhancement of thermoelectric performance by low thermal conductivity of an organic-inorganic composite.

〇Koji Miyazaki¹ (1.Kyushu Inst. Tech.)

Keywords:thermoelectricity, interfacial thermal resistance, 3 omega method

High thermoelectric performance can be achived by low thermal conductivity of the materials. Here, we make an organic-inorganic composite to reduce the thermal conductivity. The extremely low thermal conductivity can be expected by their high interfacial thermal resisntace. The interfacial thermal resistance between Bismuth telluride and polyimide was measured to be in the order of 10^-7 ( m²·K ) / W. The measured resistance is 10 times larger than the standard interfacial resistance between inorganic materials.