The 65h JSAP Spring Meeting, 2018

Presentation information

Symposium (Oral)

Symposium » Challenge to heat dissipation problems by organic-inorganic materials -Forefront of physics and application-

[19p-C304-1~9] Challenge to heat dissipation problems by organic-inorganic materials -Forefront of physics and application-

Mon. Mar 19, 2018 1:15 PM - 6:50 PM C304 (52-304)

Yoshiyuki Nonoguchi(NAIST), Toshio Baba(JST), Hiroyuki Akinaga(AIST)

5:10 PM - 5:55 PM

[19p-C304-7] Thermal conductive phenomena for insulating polymers and composites

Yoshitaka Takezawa1 (1.Hitachi Chemical)

Keywords:polymer, electrical insulation, thermal conductivity

Most of resins are amorphous and are hard to discuss it in phonon engineering. It is, however, necessary to understand phonon scattering to increase the thermal conductivity. The comprehension of the phonon scattering of the resin / filler interface is also important for the composite using the percolation. In this presentation, I would explain the high thermal conductive technology for each of thermosetting resin or thermoplastics, and the mesogenic epoxy resin.