The 65h JSAP Spring Meeting, 2018

Presentation information

Oral presentation

22 Joint Session M » 22.1 Joint Session M "Phonon Engineering"

[20a-C304-1~9] 22.1 Joint Session M "Phonon Engineering"

Tue. Mar 20, 2018 9:15 AM - 11:45 AM C304 (52-304)

Yoshiaki Nakamura(Osaka Univ.), Masahiro Nomura(Univ. of Tokyo)

11:30 AM - 11:45 AM

[20a-C304-9] Local heat transport measurement by using micro thermocouple sensor and electron beam induced heating

Armandas Balcytis1, 〇Meguya Ryu2, Saulius Juodkazis1, Junko Morikawa2 (1.Swinburne Univ., 2.Tokyo tech.)

Keywords:micro-sensor, electron beam lithography, SiN membrane

The electron beam induced heating was detected by the micron scale Au-Ni thermocouple sensor. The sensor having 2.5 µm square hot junction on the 30 nm thick Si3N4 membrane was fabricated by the electron beam lithography and the lift off process. The sensor is sensitive enough to detect the heating of electron beam absorption because of the low heat capacity of the thin substrate. This design for the micro thermocouple is also advantageous in respect of the transient measurement due to its short response time. The thin substrate of the 30 nm thick Si3N4 membrane has the minute effect of secondary electron, so that it can avoid the loss in spatial resolution of energy deposition and realize a heat source of ~1 µm diameter. Since the combination of the electron beam induced heating and the fabricated device is useful for the measurement of the heat transport in this scale.