The 65h JSAP Spring Meeting, 2018

Presentation information

Oral presentation

22 Joint Session M » 22.1 Joint Session M "Phonon Engineering"

[20p-C304-1~15] 22.1 Joint Session M "Phonon Engineering"

Tue. Mar 20, 2018 12:45 PM - 5:00 PM C304 (52-304)

Takanobu Watanabe(Waseda Univ.), Takahiro Yamamoto(Tokyo Univ. of Sci.), Takao Mori(NIMS)

2:45 PM - 3:00 PM

[20p-C304-8] Ballistic heat transport in SiGe nanowires

〇(M1)Noboru Okamoto1, Ryoto Yanagisawa1, Mahfuz Alam2, Kentaro Sawano2, Masahiro Nomura1,3,4 (1.IIS Univ. of Tokyo, 2.Univ. of Tokyo City, 3.NanoQuine Univ. of Tokyo, 4.JST PRESTO)

Keywords:phonon, nanowire, Silicon Germanium

In recent years, the development of processing technology at the nanoscale enable us to observe new physics in heat conduction, and one of them is ballistic heat transport. Ballistic heat transport has been reported in the CVD grown SiGe nanowire structure where thermal phonons have the long mean free path of several tens of μm. However, in order to realize ballistic heat transport at room temperature, smooth interfaces and high crystallinity for suppressing diffusive scattering are required. In this study, we report ballistic heat transport at room temperature in SiGe nanowires fabricated by top down processing using RIE.