[18a-E303-1~12] 13.1 Fundamental properties, surface and interface, and simulations of Si related materials

[18a-E303-2] Design and Verification of Water Flow in Batch-Type Silicon Wafer Wet Cleaner

〇Toshinori Takahashi¹, Miya Matsuo¹, Hitoshi Habuka¹, Akihiro Goto² (1.Yokohama Nat. Univ., 2.Pre-Tech)

Keywords:silicon wafer cleaner, water flow

In the process of cleaning a silicon wafer which is a semiconductor substrate material, it is a problem that part of the dirt returns to the wafer surface and reattaches according to the circulating flow of the cleaning tank. In the previous report , in this study, since the cleaning effect by the discharge hole was verified by visualization observation, details are reported. It was shown by numerical calculation that the circulation flow can be suppressed by providing the discharge hole at the upper end of the tank wall.