The 80th JSAP Autumn Meeting 2019

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[18p-E304-1~10] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

Wed. Sep 18, 2019 1:45 PM - 4:15 PM E304 (E304)

Hiroshi Ikenoue(Kyushu Univ.), Hitoshi Habuka(Yokohama Natl. Univ.)

2:30 PM - 2:45 PM

[18p-E304-4] Chemical reaction of boron trichloride gas at silicon surface

Mitsuko Muroi1, Ayami Yamada1, Ayumi Saito1, Hitoshi Habuka1 (1.Yokohama Nat. Univ.)

Keywords:epitaxial growth, silicon, doping

In the process of forming a semiconductor Si thin film by chemical vapor deposition, it is necessary to add a dopant (doping) to adjust the resistivity, so that n-type and p-type doping gases are respectively phosphine (PH3) and Diborane (B2H6) is used. B2H6, which is mainly used in p-type, is flammable and toxic, has a high risk, and is designated as a specific high pressure gas, so care must be taken in its handling. On the other hand, boron trichloride (BCl3) is mentioned as a safe doping gas. BCl3 is noncombustible, although it has a pungent odor, and is safer than B2H6. However, since BCl3 is widely known as an etching gas, etching may be accompanied by doping. So, in this research, in order to use BCl3 which is a safe gas for B doping of Si film, since the chemical reaction on the Si substrate surface was investigated, it reports in detail.