The 80th JSAP Autumn Meeting 2019

Presentation information

Oral presentation

8 Plasma Electronics » 8.6 Plasma Electronics English Session

[18p-F211-1~6] 8.6 Plasma Electronics English Session

Wed. Sep 18, 2019 1:45 PM - 4:00 PM F211 (F211)

Masafumi Jinno(Ehime Univ.), Hiroki Kondo(Nagoya University)

3:30 PM - 3:45 PM

[18p-F211-5] Interfacial Interaction Effect on Thermal Transport Properties of Silicon Nanocrystals and Polymer Nanocomposite Thin Film

〇(D)Firman Bagja Juangsa1, Ryu Meguya1, Junko Morikawa1, Tomohiro Nozaki1 (1.Tokyo Inst. of Tech.)

Keywords:Nanocomposite, Interfacial Interaction, Silicon Nanocrystals

Bulk-size nanostructured materials have been extensively studied and developed to utilize and observe the nanomaterial’s unique properties, including thermal transport property. Nanocomposite structure employing SiNCs has been used for various application such as solar cell, biosensor, and thermoelectric. In the previous works, the thermal transport analysis on SiNCs and polystyrene (PS) nanocomposite showed a significant thermal transport suppression that is attributed to the vast material interface area and the thermal resistance at material interfaces. On the other hand, the polymer is known as a soft material that has morphology dependent properties, which may be affected by molecular interaction at the material interface. In this work, thermal transport investigation is focused on the properties of polymer matrix at the region near to interfacial boundaries that are called interfacial region. Two types of SiNCs with significantly different particle size are employed in the nanocomposite to observe the effect of interface area and the property of the interfacial region on the thermal conductivity of the nanocomposite.