The 80th JSAP Autumn Meeting 2019

Presentation information

Oral presentation

Joint Session M » 22.1 Joint Session M "Phonon Engineering"

[19a-E214-1~5] 22.1 Joint Session M "Phonon Engineering"

Thu. Sep 19, 2019 10:00 AM - 11:15 AM E214 (E214)

Atsushi Ogura(Meiji Univ.)

10:15 AM - 10:30 AM

[19a-E214-2] Measuring Thermal Conductivity and Interface Thermal Resistance of Film by 3ω-Method

Yuki Sekimoto1, Masakazu Nakamura1, Ming Chen2, Paddy K.L. Chan2 (1.NAIST, 2.Hong Kong Univ.)

Keywords:thermal conductivity, interface thermal resistance, thin film

Recently, thermoelectric devices used organic or organic and inorganic hybrid materials are studied because of flexibility and low thermal conductivity. On the other hand, from demand for heat radiation from wearable devices or vehicle, light and flexible high thermal conductivity devices becomes important. So in this reaserch we measure the thermal conductivity of thin film using 3ω method. in addition we evaluate interface thermal resistance between film and substrate.