[19a-E214-1~5] 22.1 Joint Session M "Phonon Engineering"

[19a-E214-2] Measuring Thermal Conductivity and Interface Thermal Resistance of Film by 3ω-Method

〇Yuki Sekimoto¹, Masakazu Nakamura¹, Ming Chen², Paddy K.L. Chan² (1.NAIST, 2.Hong Kong Univ.)

Keywords:thermal conductivity, interface thermal resistance, thin film

Recently, thermoelectric devices used organic or organic and inorganic hybrid materials are studied because of flexibility and low thermal conductivity. On the other hand, from demand for heat radiation from wearable devices or vehicle, light and flexible high thermal conductivity devices becomes important. So in this reaserch we measure the thermal conductivity of thin film using 3ω method. in addition we evaluate interface thermal resistance between film and substrate.