The 80th JSAP Autumn Meeting 2019

Presentation information

Oral presentation

Joint Session M » 22.1 Joint Session M "Phonon Engineering"

[19p-E214-1~12] 22.1 Joint Session M "Phonon Engineering"

Thu. Sep 19, 2019 1:15 PM - 4:45 PM E214 (E214)

Tsunehiro Takeuchi(Toyota Technol. Inst.), Takanobu Watanabe(Waseda Univ.), Tsuyohiko Fujigaya(Kyushu Univ.)

1:15 PM - 1:30 PM

[19p-E214-1] Mesogenic Epoxy Resin Film having Anisotropic Thermal conductivity

Yoshitaka Takezawa1, Ning Tang2, Shingo Tanaka2 (1.Hitachi Chem., 2.Hitachi)

Keywords:high thermal conductive resin, anisotropic thermal conductivity

Epoxy resins are used as good insulating materials, but they have quite low thermal conductivities. We have developed the novel epoxy resin having mesogen group (LC-epoxy) to improve the thermal conductivity. In this presentation, LC-epoxy films with thinner thickness present higher thermal conductivities and anisotropies than those of thermosetting polymers through orienting along the coating direction. High thermal conductivity of 9.2 W m-1 K-1 and over 200 times anisotropy of LC-epoxy films has been achieved by forming highly ordered structure. The value of the thermal conductivity is remarkable among the thermosetting polymers and ceramic glass, and the LC-epoxy film would be applied for highly thermal conductive adhesives and packaging materials in electrical and electronic devices.