The 66th JSAP Spring Meeting, 2019

Presentation information

Poster presentation

7 Beam Technology and Nanofabrication » 7 Beam Technology and Nanofabrication (Poster)

[10p-PA6-1~6] 7 Beam Technology and Nanofabrication (Poster)

Sun. Mar 10, 2019 4:00 PM - 6:00 PM PA6 (PA)

4:00 PM - 6:00 PM

[10p-PA6-6] Peel strength evaluation of the Al foil/AlN junctions by surface activated bonding

Shotaro Horikawa1 (1.Osaka City Univ.)

Keywords:Surface activated bonding method, Power device, AlN