The 66th JSAP Spring Meeting, 2019

Presentation information

Oral presentation

Code-sharing session » 【CS.8】Code-sharing Session of 9.4 & 12.3 & M

[10p-W351-1~9] CS.8 Code-sharing Session of 9.4 & 12.3 & M

Sun. Mar 10, 2019 1:45 PM - 6:00 PM W351 (W351)

Yoshiyuki Nonoguchi(NAIST), Masahiro Nomura(Univ. of Tokyo), Atsuko Kosuga(Osaka Pref. Univ.)

3:15 PM - 4:00 PM

[10p-W351-4] [INVITED] Start-up company of AlN whisker fillers for high-thermal conductivity resin

Toru Ujihara1,2 (1.IMaSS Nagoya Univ., 2.U-MAP)

Keywords:heat radiation, thermal management, startups

We have developed AlN whisker fillers for increasing thermal conductivity of resin materials. The improvement of heat radiation performance is an important issue for device design. So, we made collaborative researches with many companies. Two years ago, we founded a startup company because of the advice of a business manager. In this presentation, we will introduce the feature of this material, the reason of foundation of startup, the effect of activity in startup company on the scientific activity and others.