The 66th JSAP Spring Meeting, 2019

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13 Semiconductors » 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[11a-PB3-1~11] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

Mon. Mar 11, 2019 9:30 AM - 11:30 AM PB3 (PB)

9:30 AM - 11:30 AM

[11a-PB3-10] Theoretical study on promotion effect of neutral electroless copper plating by magnetic field

〇Raiji Tanabe1, Sugiura Osamu1 (1.Chiba Inst. of Tech.)

Keywords:electroless copper plating, cobalt complex, paramagnetism, diamagnetism