The 66th JSAP Spring Meeting, 2019

Presentation information

Poster presentation

13 Semiconductors » 13.7 Compound and power electron devices and process technology

[11p-PB3-1~27] 13.7 Compound and power electron devices and process technology

Mon. Mar 11, 2019 1:30 PM - 3:30 PM PB3 (PB)

1:30 PM - 3:30 PM

[11p-PB3-25] Fabrication of GaAs/Diamond direct bonding for high power device applications

Yuji Nakamura1, Satoshi Masuya2, Makoto Kasu2, Naoteru Shigekawa1, Jianbo Liang1 (1.Osaka City Univ., 2.Saga Univ.)

Keywords:diamond, semiconductor