The 66th JSAP Spring Meeting, 2019

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power electron devices and process technology

[9p-M121-1~14] 13.7 Compound and power electron devices and process technology

Sat. Mar 9, 2019 2:00 PM - 5:45 PM M121 (H121)

Kozo Makiyama(Fujitsu Lab.)

2:30 PM - 2:45 PM

[9p-M121-3] High Breakdown Capability of GaN p-n Diodes with Two-Step Mesa Structure

Hiroshi Ohta1, Naomi Asai1, Fumimasa Horikiri2, Yoshinobu Narita2, Takehiro Yoshida2, Tomoyoshi Mishima1 (1.Hosei univ., 2.SICOCS)

Keywords:GaN p-n diode, Tow-step mesa structure, High breakdown capability

We studied vertical GaN p-n junction diodes using two-step mesa structure in which a part of the p-GaN layer around the anode-electrode was removed by ICP dry etching for the purpose of high breakdown capability. As a result, it was found that no breakdown occurs even after the yield at the reverse voltage of about 4.8 kV. In addition, no increase in specific on-resistances in the forward current-voltage characteristics was observed, and equivalent to those of the conventional single mesa structure diodes were obtained.